Description
ALPHA EF-2202, is a VOC-free, halide-free, rosin/resin-free, low solids no-clean flux which provides the highest activity of any VOC-free Bellcore compliant flux for defect-free soldering. It is formulated with a proprietary mixture of organic activators which deliver excellent wetting and top-side hole fill, even with OSP coated bare copper boards which have undergone prior thermal excursions. Several proprietary additives are also formulated into ALPHA EF-2202 which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation. The formulation of ALPHA EF-2202 is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.
