Description
ALPHA EF-8300 is a rosin-containing flux designed to provide the attributes of excellent solderability and reliability in general and high-density boards in both Lead-Free and eutectic tin/lead processes. It is designed to have low bridging on bottom side QFP’s with 144-168 leads as well as superior performance in hole-fill and solderballing. Additionally, it provides good lead free solder joint cosmetics with an evenly spread, tack free residue.
EF-8300 allows for good hole-fill as demonstrated by its >96% yield on 10 mil holes. It also allows for low bridging performance on connectors. EF-8300 spreads evenly and leaves a tack free residue and can be used in lead-free as well as Sn/Pb processes.
