Description
Heat sink compound is generally used to thermally bond a component with a mechanical heat sink to aid in the dissipation of heat. Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects.
- Thermal conductivity - @ 36°C., 0.70 BTU inch/Hr. Ft.2 °F.
- Functional temperature range -40°F to 392°F (-40°C to 200°C)
- Non-ozone depleting
- Avoid solder defects due to silicon contamination
- Easy application
- Will not separate
- Will not harden and crack
