PACE - TF 1800 BGA and SMD Rework System

PACE’s TF 1800 BGA/SMD Rework System: 

With its groundbreaking, patent-pending Inductive-Convection Heating Technology,the TF 1800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application. 

The TF 1800’s Inductive-Convection Heating Technology provides ultimate thermal performance by its ability to instantly heat up and cool down the temperature of the air it delivers to the work. The air is first pre-heated in the outer chamber as it moves in a cyclonic fashion around the induction coil before it enters the inner chamber. It’s then heated to target temperature through a highly efficient heat transfer process in an energized induction field. During active cooling, the induction coil is de-energized. The heater’s unique low thermal mass design further enhances the system’s ability to heat up and cool down quickly and gives the operator an unsurpassed level of process control in developing thermal profiles for the particular rework task at hand.