Description
ALPHA OM-565 HRL3 low temperature solder paste was formulated for a broad range of assemblies to mitigate warpage induced defects in temperature sensitive chip-scale packages. ALPHA OM-565 HRL3 is designed to enable target reflow temperatures of 175 °C with superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HiP). (Available in particle size 4 and 5)
