Description
ALPHA SLS 65 was specifically developed to eliminate the tendency for solder balling and solder bridging – two defects which are normally associated with the use of the chip wave. Of all low solids (<4% solids), no-clean fluxes, SLS 65 exhibits the lowest tendency for solder ball generation over a wide variety of solder masks. SLS 65 should be considered for use by any assembler who has board designs which are sensitive to solder bridging, performs pin testing, and / or whose specification requires an extremely low frequency of solder balls.
Features and Benefits
- Thermally stable activators provide the lowest solder bridging in a low-solids, no-clean flux.
- Reduces the surface tension between solder and resist to provide the lowest solder ball frequency of any low
- solids, no-clean flux.
- Very low level of non-tacky residue to reduce interference with pin testing and exhibit no visible residue.
- Cleaning is not required which reduces operating costs.
- Bellcore Compliant for long term electrical reliability.
