Description
ALPHA EF-8000 is a rosin-containing flux designed to provide the attributes of excellent solderability and reliability in general and high-density boards in both Lead-Free and eutectic tin⁄lead processes. It is designed to have low bridging on bottom side QFP's with 144-168 leads as well as superior performance in hole fill and solderballing. Additionally, it provides good lead free solder joint cosmetics with an evenly spread, tack free residue.
EF-8000 spreads evenly and leaves a tack-free residue. Performance of lead-free soldering on various board finishes is excellent, it can also be used in Sn⁄Pb processes.
